Stackup! -

A pre-cured, rigid insulating material (often FR-4) with copper bonded to both sides.

A standard multi-layer PCB is composed of three primary materials: StackUp!

A paper about (specifically PCB Layer Stackup ) describes the critical arrangement of conductive and insulating layers that form the foundation of modern electronics. A well-designed stackup serves as more than just a physical support; it is a primary tool for ensuring signal integrity , managing electromagnetic interference (EMI) , and maintaining thermal stability. The Architecture of a PCB Stackup A pre-cured, rigid insulating material (often FR-4) with

Experts from Altium and Sierra Circuits emphasize several vital design rules: Designing a Stackup for High Speed Design The Architecture of a PCB Stackup Experts from

Partially cured fiberglass resin that acts as the "glue," bonding the cores and copper layers together during the lamination process. Key Design Considerations

Conductive sheets used for top and bottom outer layers.