: Equalizing temperatures across the entire board and allowing the flux to activate and clean the surfaces.
The current version is (released January 2025), which expands beyond reflow and wave soldering to include vapor phase, laser, and selective soldering processes. Core Stages of a Thermal Profile
: Gradually increasing the temperature to avoid thermal shock to the PCB or components.
: The duration the solder remains in a liquid state.
A compliant thermal profile typically consists of four critical phases:
: The stage where the temperature exceeds the solder's liquidus point to form the joint.